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Brand Name : Lensen
Certification : CE
Place of Origin : China
Layer : 6L
Base Material : FR4 TG170
Board Thickness : 1.54mm
Final Copper Thickness : 1OZ
High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4*5.37
Min Hole Size: 0.15mm
Special Request: Impedance Control
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1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board Images |